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Delph機械類筆試題
Delphi筆試題目
機械類筆試試題
1. Briefly describe what is blanking(cutting), forming, coining and embosing in stamping process.
2. What is metal clading?
3. What is the purpose of adding glass fiber to thermoplastic material?
4. In contrast with metal and thermoplastic material, which has a higher coefficient of thermal expansion(CTE).
5. The most suitable material for a integral hinge design (typical plastic thickness=0.25 to 0.5mm at hinge)
6. Can a bending load makes both compressive and tensile stress in a member?
7. What is the design criteria used in plastics catch/snap?
8. What is FEA?
9. Why is natural frequency important in vibration analysis?
10. What is the deflection equation of a cantilever beam fixed at one edge ?
EE筆試試題
1. Name 3 Vehicle Buses.
2. Name 2 possible sources of Electromagnetic interference on Electronics Circuit ASM.
3. Wavelength for 12MHz frequency signal is____
4. Name 2 important considerations for car radio performance related to audio signal processing under multipath condition?
5. What is the typical FM receiver RF signal strength to achieve 30dB S/N for car radio?
6. When a radio is tuned to 98.1 MHz & with a LO of 108.8 MHz, what is the image frequency?
7. For a system with a matched impedance, what is the Reflection Coefficient and SWR?
8. Which property of the output capacitor is the primary cause of Low Drop Out(LDO) regulator loop instability?
（1）Equivalent series resistance(ESR)
（2）Effective series inductance(ESL)
（3）Capacitance value
（4）Dielectric material
9. The switching regulator is capable of:
（1）Higher power conversion efficiency
（2）Providing an output voltage that is higher than the input
（3）Generating an output boltage oppsite in polarity to the input
（4）All of the above
10. A linear regulator op Vin(max) = 10v, Vout(min) = 4.8v, Iout(max) = 2. 5mA, Iq(max) = 2.5mA, Ta(max) = 8.5攝氏度，The regulator is available in 3 packages.Each package has the following thermal characteristics:
Package Rja（攝氏度/W） Rjc（攝氏度/W） SO14 125 30 D1P8 100 52
Choose the most suitable package to handle the power dissipation requirement without a heat sink and why.
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